Components for power electronics, automations, electronics, electric

The main advantage of analyzing a device’s immunity at the integrated circuit level is that such testing does not require consideration of the influence of the circuit’s design on electromagnetic compatibility (EMC). This analysis includes, for example, the design of the printed circuit board, the nature and availability of connectors, and the enclosure. The article describes the relationship between testing at the device level and at the integrated circuit (IC) level.

EMI (Electromagnetic Interference) refers to unwanted signals that can disrupt the operation of electronic devices. As electronics become smaller and more complex, they also become more susceptible to such interference. EMI can lead to errors, instability, or even system failures. That’s why proper circuit design — including electromagnetic shielding at the PCB level — is so important. This article explains how EMI shielding works, what materials to use, and how to avoid common design pitfalls.

Navitas Semiconductor, a leader in GaN and SiC technology, has introduced new 1200V SiCPAK™ power modules with epoxy insulation, offering five times better thermal resistance than traditional solutions. Thanks to proprietary GeneSiC™ SiC MOSFET technology, the new modules ensure lower power loss, higher reliability, and resilience in extreme conditions. They are designed for applications such as EV chargers, industrial drives, UPS systems, and photovoltaic installations. As a pioneer in next-generation semiconductors, Navitas also offers the world’s first 20-year warranty on GaNFast™ devices.